Kinetics is a leading supplier of innovative electroplating (ECD) process solutions. Kinetics specializes in the design and manufacture of both – standard and custom plating equipment. Our portfolio of process platforms range from manual to automated which are configured to meet your specific requirements. Kinetics specializes in pattern and alloy plating with hundreds of systems installed in leading R&D, Pilot Line and HVM facilities.
Portfolio of ECD application solutions include:
- Advanced Packaging: TSV, Copper Pillar, RDL, Pad, WLP, Solder, UBM
- MEMS Patten Plating : Cu, Au, Ni, Pt, Ru, SnAg
- Magnetic Deposition: NiFe, NiFeCo
- 100mm to 450mm silicon wafers, III-V substrates
- Electroless Deposition and Electro-Etch
- Custom substrates